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IEC 61192-2 Ed. 1.0 b PDF
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Workmanship requirements for soldered electronic assemblies – Part 2: Surface-mount assemblies
| Published by | Publication Date | Number of Pages |
| IEC | 03/14/2003 | 127 |
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IEC 61192-2 Ed. 1.0 b – Workmanship requirements for soldered electronic assemblies –Part 2: Surface-mount assemblies
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
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