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IEC 61189-3-719 Ed. 1.0 b PDF
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3-719: Test methods for interconnection structures (printed boards) – Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
| Published by | Publication Date | Number of Pages |
| IEC | 01/05/2016 | 22 |
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IEC 61189-3-719 Ed. 1.0 b – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3-719: Test methods for interconnection structures (printed boards) – Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
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