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IEC 61189-2-807 Ed. 1.0 b PDF
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (Td) using TGA
| Published by | Publication Date | Number of Pages |
| IEC | 09/01/2021 | 22 |
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IEC 61189-2-807 Ed. 1.0 b – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (Td) using TGA
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td)
of base laminate materials using thermogravimetric analysis (TGA).
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