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IEC 61188-6-2 Ed. 1.0 b PDF
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Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)
| Published by | Publication Date | Number of Pages |
| IEC | 02/04/2021 | 49 |
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IEC 61188-6-2 Ed. 1.0 b – Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.
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