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IPC 4104 PDF
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Specifications for High Density Interconnect (HDI) and Microvia Materials
| Published by | Publication Date | Number of Pages |
| IPC | 05/01/1999 | 100 |
IPC 4104 – Specifications for High Density Interconnect (HDI) and Microvia Materials
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.
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