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IEC 61192-3 Ed. 1.0 b PDF
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Workmanship requirements for soldered electronic assemblies – Part 3: Through-hole mount assemblies
| Published by | Publication Date | Number of Pages |
| IEC | 12/17/2002 | 93 |
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IEC 61192-3 Ed. 1.0 b – Workmanship requirements for soldered electronic assemblies – Part 3: Through-hole mount assemblies
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
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