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IEC 61190-1-1 Ed. 1.0 b PDF
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Attachment materials for electronic assembly – Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
| Published by | Publication Date | Number of Pages |
| IEC | 03/25/2002 | 41 |
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IEC 61190-1-1 Ed. 1.0 b – Attachment materials for electronic assembly – Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
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