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IEC 61188-1-2 Ed. 1.0 b PDF
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Printed boards and printed board assemblies – Design and use – Part 1-2: Generic requirements – Controlled impedance
| Published by | Publication Date | Number of Pages |
| IEC | 04/29/1998 | 83 |
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IEC 61188-1-2 Ed. 1.0 b – Printed boards and printed board assemblies – Design and use – Part 1-2: Generic requirements – Controlled impedance
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
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